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Hitachi Maxell(Sliontec Division)

Hitachi Maxell(Sliontec Division)

Semiconductors

We provide the most suitable tapes, mainly UV-cure type, for diversified manufacturing process of semiconductors that market is growing continuously.

Product Information
Image Product Information Application

No636000 Dicing tape (for Wafer)

Tape thickness:0.100 mm

Adhesion:
1st surface:2.80 N/10mm

Single coated

  • For all kinds of wafer dicing
  • Dicing tape(for Wafer)

No636015 Dicing tape (for Circuit Boards)

Tape thickness:0.160 mm

Adhesion:
1st surface:2.80 N/10mm

Single coated

  • For all kinds of substrate dicing
  • Dicing tape(for Circuit Boards)

No636020 Dicing tape (for Wafer)

Tape thickness:0.100 mm

Adhesion:
1st surface:3.20 N/10mm

Single coated

  • For all kinds of wafer dicing
  • Dicing tape(for Wafer)
  • High fixation power

No636025 Dicing tape (for Circuit Boards)

Tape thickness:0.160 mm

Adhesion:
1st surface:3.50 N/10mm

Single coated

  • For all kinds of substrate dicing
  • Dicing tape(for Circuit Boards)
  • Easy pick up

No636050 Dicing tape (for Wafer)

Tape thickness:0.100 mm

Adhesion:
1st surface:2.60 N/10mm

Single coated

  • For all kinds of wafer dicing
  • Dicing tape(for Wafer)
  • Easy pick up

No636055 Dicing tape (for Circuit Boards)

Tape thickness:0.160 mm

Adhesion:
1st surface:2.90 N/10mm

Single coated

  • For all kinds of substrate dicing
  • Dicing tape(for Circuit Boards)
  • Easy pick up

No636095 Dicing tape (for Circuit Boards)

Tape thickness:0.170 mm

Adhesion:
1st surface:4.10 N/10mm

Single coated

  • For all kinds of substrate dicing
  • Dicing tape(for Circuit Boards)
  • Easy pick up
  • Strong adhesion

No636200 Dicing tape (for Circuit Boards)

Tape thickness:0.160 mm

Adhesion:
1st surface:3.50 N/10mm

Single coated

  • For all kinds of substrate dicing
  • Dicing tape(for Circuit Boards)
  • Easy pick up
  • Burr free